Optimizing a process is no easy feat—no matter if it's a team of 10 people or 10,000. ProjectManager is cloud-based work and project management software that can help you with process optimization. You can …
Download Citation | Process Optimization of Ion Plating Nickel-Copper-Silver Thin Film Deposition | Simulation of thin film nano deposition manufacturing processes can …
Nowadays, electroplating is an important step in the fabri-cation process of printed circuit boards (PCBs) and micro-antenna devices [1–3]. Generally, the electroplating step is a process that uses electrical current to reduce dissolved metal cations in order to form a metal coating on a substrate. PCBs
It presents a method to predict and optimize the electroless plating process, and to compare the predictive ability of the network to the experimental results. It combined with the neural network and orthogonal experiment and used a small step searching method to optimize the chemical process of plated Ni - Co-Fe-P on carbon fiber within the scope of the process parameters, …
Second, a Nickel Brush Plating process that generates a considerable amount of waste in the process of washing plated parts. As part of recommendations to reduce waste for the process, the group provided the company with two different leads on newer equipment for plating purposes: Sifco Applied Surface Concepts and Liquid Development Company.
Process optimization means making any business process more efficient, logical, and inexpensive. Optimizing a process typically also means using technology to automate key repeatable aspects of that process and remove bottlenecks. Process automation can happen in a workflow that has two steps, 200 steps, or any number of steps in between.
Electroplating 101. Electroplating, or electrodeposition, is the process of coating a thin layer of metal onto another metal object. It's known for making inexpensive metals look expensive, but it can also help prevent …
A Look at the Metal Plating Process and Techniques. The plating process is a manufacturing process in which a thin layer of metal coats a substrate. Metal plating provides many benefits to products made from metal and other materials. This is mostly achieved through electroplating, which requires an electric current, or through electroless ...
The business process optimization workflow. There is no one clear or defined systematic approach to process optimization that everyone agrees on. There are a number of options or approaches you can take and I'll …
The optimum concentrations for electroless Ni–P plating were 27.0 g/L for NiSO 4, and 24.0 g/L for NaH 2 PO 2. The coating thickness was thicker at up to pH 4, but it was thinner after that. The deviations in the coating thickness decreased at up to pH 4, but it was increased after that. So the optimum pH of the plating solution was 4.
the term "ion plating" to describe the deposition of metal vapor onto a negatively biased substrate in a low- pressure abnormal glow discharge. Early ion plating sys- …
Request PDF | Optimization of the Copper Plating Process Using the Taguchi Experimental Design Method | Copper electroplating formulas composed of CuSO4, H2SO4, chloride ions, polyethylene glycol ...
The operations of a plating process including the degreaser and acid system together with the plating tank is subject to various constraints. These include chemical makeup, temperatures and ... For the purpose of illustrating the benefits of process optimization the following company's operating conditions would be used in the Mat Lab model.
Nowadays, electroplating is an important step in the fabrication process of printed circuit boards (PCBs) and micro-antenna devices [1–3].Generally, the electroplating step is a process that uses electrical current to reduce dissolved metal cations in order to form a metal coating on a substrate.
Regardless of the industry, a company's process optimization project must identify ways to make their business processes manageable, with formalized, actionable information about how, and how well, the process is executing. Not unlike any other project, a business process optimization project must define the scope of the process to eliminate ...
8. PDCA. PDCA stands for Plan, Do, Check, Act and is another popular technique used in many companies for process optimization. The process takes followers through the following sequence: P. Plan. Establish objectives and method to …
The apparatus used to practice electroplating may be designed to have a geometric configuration tha ... GEOMETRY AND PROCESS OPTIMIZATION FOR ULTRA-HIGH RPM PLATING . United States Patent Application 20160222535 ... METHOD OF FORMING A PROCESS CHAMBER COMPONENT HAVING ELECTROPLATED YTTRIUM CONTAINING …
Plating/Coating Optimization Plating and coating processes can be valuable manufacturing operations to transform the surface of a component. Both plated and coated surfaces can benefit from increase corrosion resistance, wear resistance, and/or aesthetic changes.
A copper electroplating process suitable for routine IC manufacturing use must deliver Cu films that reproducibly fill deep, narrow damascene features. In this paper, several important factors such as seed layer coverage, plating waveform (DC, reversed-pulse), and additive chemistry formulation were examined in terms of their effect on the elimination of …
The main purposes of process optimization are: To increase the productivity with lowest applicable cost. To eliminate losses as much as possible. To utilize lower cost feed stock, energy with acceptable quality level. To maximize the operating capacity of process equipment. To design & operate the plant at the most optimum condition.
Click here to get The Process for Optimizing a Process! Now, having a process to optimize a process is – you're right – very meta. But considering that checklists reign supreme when it comes to completing …
The article is devoted to the development of an approach to improving the electroplating uniformity on the cathode surface, rotating around its axis, using a …
In many companies, process optimization is also referred to as process innovation and is managed via a continuous improvement process (CIP). Process optimization follows the logic of the so-called PDCA cycle, one of the foundations of quality management according to ISO 9001. The steps "Plan-Do-Check-Act" designate the four phases of ...
High substrate warpage can lead to unacceptable yield loss during chip attach in assembly, and cause high yield fallout during package mount on the circuit board. For the first time, through this work, the electrolytic copper (Cu) plating process in substrate manufacturing was shown to contribute significantly to package warpage. For a 14×14mm package, reducing the Cu …
The experimental parameters of the optimal coating were temperature 75 °C, pH value 8.5 and Ni2+ concentration 1.2 g/L. The electrochemical tests …
Process optimization of electroless copper plating and its influence on electrochemical properties of AB 5-type hydrogen storage alloy. Author links open overlay panel Bo ZHANG Wenyuan WU Shaohua YIN Shiwei LI Yao LUO Xue BIAN Ganfeng TU. Show more.
Step 2: If needed, rinsing and drying are performed. Step 3: The next step is to sunblast the metal surface with aluminum oxide. This roughens the surface so that the metal plating will adhere to the surface of the metal better during the plating process. Step 4: If needed, the rinsing process is conducted again.
Optimization of electroless Ni–P barrel plating The size and quantity of the barrel pores are very important factors for barrel plating because the plating solution circulates smoothly with the open pore ratio increases. The open pore ratio of a barrel is affected by the diameter and quantity of barrel pores per unit area.
Ni–TiC composite coatings were prepared on substrate of aluminum alloy by pulse electrodeposition. The plating parameters for optimizing wear and corrosion resistance of Ni–TiC composite coatings were selected by orthogonal test, including the TiC particles concentration, current density, duty cycle, frequency and stirring rate. A three-layer back propagation (BP) …
Process control and optimization is a critical aspect of process analytical technology (PAT), quality by design (QbD), and the implementation of continuous manufacturing procedures. While process control and optimization techniques have been utilized in other manufacturing industries for decades, the pharmaceutical industry has only recently ...
The invention discloses a kind of electroplating pretreatment process optimization method, this method is comprised the following steps that:1）, the workpiece for needing to electroplate polished, polished, tumbling, scratch brushing and grit blasting operation processing；2）, to step 1）The smooth workpiece of middle surface treatment is hung on the negative electrode of …
US20160222535A1 US14/613,306 US201514613306A US2016222535A1 US 20160222535 A1 US20160222535 A1 US 20160222535A1 US 201514613306 A US201514613306 A US 201514613306A US 2016222535 A
What process optimization can bring to you company is a way to reduce money, time and resources spent in a process, leading to better business results. What are the process optimization steps? The main goal of process optimization is to reduce or eliminate time and resource wastage, unnecessary costs, bottlenecks, and mistakes while achieving ...
The temperature of the plating electrolyte was maintained at 28°C. The filling performances of the various plating formulas were defined by H 2 /H 1 × , as illustrated in Fig. 2. 32 The filling performance was assessed according to the cross-section of the microvia, which was examined using an optical microscope (OM, Olympus BX51).
Process Optimization of Ion Plating Nickel-Copper-Silver Thin Film Deposition. Mike Danyluk, Mike Danyluk. Mechanical Engineering PhD Student, University of Wisconsin Milwaukee, Milwaukee, Wisconsin ... Ion Plating Model Thickness Test. Sem Results Of Extreme Doe Tests. Rolling Contact Fatigue Testing Of Extreme Doe Coated Balls. Simulation ...